Residual stress in silicon wafers and injection molded plastics
This research report provides a focused investigation and theoretical review of residual stress induced by defects such as trapped particles and gases in the silicon wafers and injection molded plastics and the application of utilizing polariscope conduct non-destructive measurement of such stress a...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2012
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/50102 |