Solder joint testing and failure analysis
Adhesively bonded joints within most electronic devices are constantly subjected to a complex combination of tensile-shear loading. These devices are also likely to undergo thermo-mechanical cycling during device processing and service and therefore, the joints are likely to have existing low-cycle...
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| 格式: | Final Year Project (FYP) |
| 语言: | English |
| 出版: |
2012
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| 在线阅读: | http://hdl.handle.net/10356/50170 |