Reliability of copper wire bonding
In this research, it is to investigate the reliability of the copper contact in chips to see if it is a viable possibility that it can replace gold bonding.
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| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2012
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| Online Access: | http://hdl.handle.net/10356/50233 |
| _version_ | 1826112867953278976 |
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| author | Ang, Joash Wei Qiang |
| author2 | Tang Xiaohong |
| author_facet | Tang Xiaohong Ang, Joash Wei Qiang |
| author_sort | Ang, Joash Wei Qiang |
| collection | NTU |
| description | In this research, it is to investigate the reliability of the copper contact in chips to see if it is a viable possibility that it can replace gold bonding. |
| first_indexed | 2024-10-01T03:13:50Z |
| format | Final Year Project (FYP) |
| id | ntu-10356/50233 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T03:13:50Z |
| publishDate | 2012 |
| record_format | dspace |
| spelling | ntu-10356/502332023-07-07T17:32:37Z Reliability of copper wire bonding Ang, Joash Wei Qiang Tang Xiaohong School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Microelectronics In this research, it is to investigate the reliability of the copper contact in chips to see if it is a viable possibility that it can replace gold bonding. Bachelor of Engineering 2012-05-31T03:27:00Z 2012-05-31T03:27:00Z 2012 2012 Final Year Project (FYP) http://hdl.handle.net/10356/50233 en Nanyang Technological University 51 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Microelectronics Ang, Joash Wei Qiang Reliability of copper wire bonding |
| title | Reliability of copper wire bonding |
| title_full | Reliability of copper wire bonding |
| title_fullStr | Reliability of copper wire bonding |
| title_full_unstemmed | Reliability of copper wire bonding |
| title_short | Reliability of copper wire bonding |
| title_sort | reliability of copper wire bonding |
| topic | DRNTU::Engineering::Electrical and electronic engineering::Microelectronics |
| url | http://hdl.handle.net/10356/50233 |
| work_keys_str_mv | AT angjoashweiqiang reliabilityofcopperwirebonding |