Physical analysis of semiconductors materials and devices
This project concerns the measurements and characterization of GaAs/Si direct wafer bonding and devices using optical and electrical methods. The limitations that lie within GaAs/Si direct wafer bonding will be identified and given improvised solutions. Dry plasma treatment is used before bonding of...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2012
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| Online Access: | http://hdl.handle.net/10356/50264 |