Effect of stress migration on electromigration for nano scale advanced interconnects
The interconnect system is a significant part of the integrated circuit because of its function to connect millions of transistors, and routing signals into and out of the chip. Therefore, investigating its reliability is a priority for the industry to ensure that the chip lifetime will meet the req...
Main Author: | Anson Heryanto |
---|---|
Other Authors: | Pey Kin Leong |
Format: | Thesis |
Language: | English |
Published: |
2012
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/50271 |
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