Study of the interfaces between electroless nickel under bump metallization and lead-free solders

Study of the interfaces between electroless nickel under bump metallization and lead-free solders

This work focuses on the interfacial reaction between Sn-bearing solders (lead-free Sn-3.5Ag and eutectic Sn-37Pb) and Ni-based UBMs (electrolessly plated Ni-P and sputtered Ni) in terms of morphology and growth kinetics of the intermetallic compound. Effect of interfacial reaction on the mechanical...

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Bibliographic Details
Main Author: He, Min.
Other Authors: Chen, Zhong
Format: Thesis
Published: 2008
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:http://hdl.handle.net/10356/5052

Internet

http://hdl.handle.net/10356/5052

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