Study of the interfaces between electroless nickel under bump metallization and lead-free solders

Study of the interfaces between electroless nickel under bump metallization and lead-free solders

This work focuses on the interfacial reaction between Sn-bearing solders (lead-free Sn-3.5Ag and eutectic Sn-37Pb) and Ni-based UBMs (electrolessly plated Ni-P and sputtered Ni) in terms of morphology and growth kinetics of the intermetallic compound. Effect of interfacial reaction on the mechanical...

Ful tanımlama

Detaylı Bibliyografya
Yazar: He, Min.
Diğer Yazarlar: Chen, Zhong
Materyal Türü: Tez
Baskı/Yayın Bilgisi: 2008
Konular:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Erişim:http://hdl.handle.net/10356/5052

Internet

http://hdl.handle.net/10356/5052

Benzer Materyaller