Study of the interfaces between electroless nickel under bump metallization and lead-free solders
This work focuses on the interfacial reaction between Sn-bearing solders (lead-free Sn-3.5Ag and eutectic Sn-37Pb) and Ni-based UBMs (electrolessly plated Ni-P and sputtered Ni) in terms of morphology and growth kinetics of the intermetallic compound. Effect of interfacial reaction on the mechanical...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/5052 |
| _version_ | 1811694860897353728 |
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| author | He, Min. |
| author2 | Chen, Zhong |
| author_facet | Chen, Zhong He, Min. |
| author_sort | He, Min. |
| collection | NTU |
| description | This work focuses on the interfacial reaction between Sn-bearing solders (lead-free Sn-3.5Ag and eutectic Sn-37Pb) and Ni-based UBMs (electrolessly plated Ni-P and sputtered Ni) in terms of morphology and growth kinetics of the intermetallic compound. Effect of interfacial reaction on the mechanical strength of the solder joints has been studied using a tensile test. Comparison of these solder/UBM systems is made in order to obtain a systematic and comprehensive understanding of the interaction in reflow and thermal aging processes. There are three separate but interrelated sub-topics in the present experimental investigation. |
| first_indexed | 2024-10-01T07:14:17Z |
| format | Thesis |
| id | ntu-10356/5052 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T07:14:17Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/50522020-06-01T11:56:54Z Study of the interfaces between electroless nickel under bump metallization and lead-free solders He, Min. Chen, Zhong School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects This work focuses on the interfacial reaction between Sn-bearing solders (lead-free Sn-3.5Ag and eutectic Sn-37Pb) and Ni-based UBMs (electrolessly plated Ni-P and sputtered Ni) in terms of morphology and growth kinetics of the intermetallic compound. Effect of interfacial reaction on the mechanical strength of the solder joints has been studied using a tensile test. Comparison of these solder/UBM systems is made in order to obtain a systematic and comprehensive understanding of the interaction in reflow and thermal aging processes. There are three separate but interrelated sub-topics in the present experimental investigation. Doctor of Philosophy (SME) 2008-09-17T10:18:36Z 2008-09-17T10:18:36Z 2004 2004 Thesis http://hdl.handle.net/10356/5052 Nanyang Technological University 214 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects He, Min. Study of the interfaces between electroless nickel under bump metallization and lead-free solders |
| title | Study of the interfaces between electroless nickel under bump metallization and lead-free solders |
| title_full | Study of the interfaces between electroless nickel under bump metallization and lead-free solders |
| title_fullStr | Study of the interfaces between electroless nickel under bump metallization and lead-free solders |
| title_full_unstemmed | Study of the interfaces between electroless nickel under bump metallization and lead-free solders |
| title_short | Study of the interfaces between electroless nickel under bump metallization and lead-free solders |
| title_sort | study of the interfaces between electroless nickel under bump metallization and lead free solders |
| topic | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects |
| url | http://hdl.handle.net/10356/5052 |
| work_keys_str_mv | AT hemin studyoftheinterfacesbetweenelectrolessnickelunderbumpmetallizationandleadfreesolders |