Design methodologies and digital circuit implementation for 3DIC wireless sensor node (WSN) system
In recent years, there is a great deal of interest in the three-dimensional integrated circuit (3D IC). By stacking multiple active device layers with vertical interconnect, 3D IC technology provides great opportunities for designers to meet power and performance requirements. In this research,...
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| Format: | Thesis |
| Language: | English |
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2012
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| Online Access: | https://hdl.handle.net/10356/50626 |