Nanometric material removal using electrokinetic phenomenon
Material removal at the sub-micron level has been a topic of interest in the past few years, particularly with respect to the fabrication of miniaturized devices. While numerous techniques have been developed and refined from their larger meso-scale counterparts (e.g. polishing), most have inherent...
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| Médium: | Diplomová práce |
| Jazyk: | English |
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2012
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| On-line přístup: | https://hdl.handle.net/10356/50630 |