Nanometric material removal using electrokinetic phenomenon

Material removal at the sub-micron level has been a topic of interest in the past few years, particularly with respect to the fabrication of miniaturized devices. While numerous techniques have been developed and refined from their larger meso-scale counterparts (e.g. polishing), most have inherent...

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Bibliographic Details
Main Author: Leo, Cheng Seng
Other Authors: Yang Chun, Charles
Format: Thesis
Language:English
Published: 2012
Subjects:
Online Access:https://hdl.handle.net/10356/50630

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