Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment
The global objective of this research endeavor is to inhibit the excessive growth of IMC and improve the properties of Sn-Ag-Cu lead-free solder alloy by adding small mount of Sb.
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis |
| Published: |
2008
|
| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/5076 |