Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices
Since the advent of microelectronics and wafer fabrication, the need for diffusion barriers/adhesion promoters in interconnect systems to enhance mechanical stability and prevent interdiffusion has emerged. This studey investigated the integrity of TiN diffusion barriers in A1 interconnect system.
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/5077 |