Development of magnetic current imaging for the failure analysis of 3D package technology

“More than Moore” trend has triggered the development of three-dimensional (3D) technologies which are important in terms of their reliability and performance. However, the introduction of these new technologies presents new challenges in fault isolation and failure analysis of short circuits, open...

全面介绍

书目详细资料
主要作者: Kor, Katherine Hwee Boon.
其他作者: Gan Chee Lip
格式: Thesis
语言:English
出版: 2013
主题:
在线阅读:http://hdl.handle.net/10356/51193