Development of magnetic current imaging for the failure analysis of 3D package technology

Development of magnetic current imaging for the failure analysis of 3D package technology

“More than Moore” trend has triggered the development of three-dimensional (3D) technologies which are important in terms of their reliability and performance. However, the introduction of these new technologies presents new challenges in fault isolation and failure analysis of short circuits, open...

Full description

Bibliographic Details
Main Author: Kor, Katherine Hwee Boon.
Other Authors: Gan Chee Lip
Format: Thesis
Language:English
Published: 2013
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
DRNTU::Engineering::Materials::Electronic packaging materials
Online Access:http://hdl.handle.net/10356/51193

Internet

http://hdl.handle.net/10356/51193

Similar Items