Development of wafer bonding technology for micro-electro-mechanical systems application

Development of wafer bonding technology for micro-electro-mechanical systems application

Anodic wafer bonding technology is an important process for fabrication and packaging of Micro-Electro-Mechanical Systems (MEMS). This study concentrates on the anodic bonding process at lower t emperatures, which is more desirable for MEMS fabrication. A model of the electrostatic force was develop...

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Bibliographic Details
Main Author: Wang, Lei.
Other Authors: Li, Guoyuan
Format: Thesis
Published: 2008
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:http://hdl.handle.net/10356/5126

Internet

http://hdl.handle.net/10356/5126

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