Development of wafer bonding technology for micro-electro-mechanical systems application
Anodic wafer bonding technology is an important process for fabrication and packaging of Micro-Electro-Mechanical Systems (MEMS). This study concentrates on the anodic bonding process at lower t emperatures, which is more desirable for MEMS fabrication. A model of the electrostatic force was develop...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/5126 |
| _version_ | 1811686346028220416 |
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| author | Wang, Lei. |
| author2 | Li, Guoyuan |
| author_facet | Li, Guoyuan Wang, Lei. |
| author_sort | Wang, Lei. |
| collection | NTU |
| description | Anodic wafer bonding technology is an important process for fabrication and packaging of Micro-Electro-Mechanical Systems (MEMS). This study concentrates on the anodic bonding process at lower t emperatures, which is more desirable for MEMS fabrication. A model of the electrostatic force was developed to investigate the relationships of the force and process parameters. The electrostatic force established during bonding becomes critical when the temperature variation is restricted. Modeling analysis showed that the magnitude of the electrostatic force was dependent on temperature and voltage, and the topology of the wafer surface does not significantly change its magnitude. |
| first_indexed | 2024-10-01T04:58:57Z |
| format | Thesis |
| id | ntu-10356/5126 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T04:58:57Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/51262023-03-04T16:31:37Z Development of wafer bonding technology for micro-electro-mechanical systems application Wang, Lei. Li, Guoyuan School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects Anodic wafer bonding technology is an important process for fabrication and packaging of Micro-Electro-Mechanical Systems (MEMS). This study concentrates on the anodic bonding process at lower t emperatures, which is more desirable for MEMS fabrication. A model of the electrostatic force was developed to investigate the relationships of the force and process parameters. The electrostatic force established during bonding becomes critical when the temperature variation is restricted. Modeling analysis showed that the magnitude of the electrostatic force was dependent on temperature and voltage, and the topology of the wafer surface does not significantly change its magnitude. Master of Engineering (SME) 2008-09-17T10:20:41Z 2008-09-17T10:20:41Z 2006 2006 Thesis http://hdl.handle.net/10356/5126 Nanyang Technological University 239 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects Wang, Lei. Development of wafer bonding technology for micro-electro-mechanical systems application |
| title | Development of wafer bonding technology for micro-electro-mechanical systems application |
| title_full | Development of wafer bonding technology for micro-electro-mechanical systems application |
| title_fullStr | Development of wafer bonding technology for micro-electro-mechanical systems application |
| title_full_unstemmed | Development of wafer bonding technology for micro-electro-mechanical systems application |
| title_short | Development of wafer bonding technology for micro-electro-mechanical systems application |
| title_sort | development of wafer bonding technology for micro electro mechanical systems application |
| topic | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects |
| url | http://hdl.handle.net/10356/5126 |
| work_keys_str_mv | AT wanglei developmentofwaferbondingtechnologyformicroelectromechanicalsystemsapplication |