Composites for microelectronics applications
In order to improve the thermal properties of polymer at lower filler content, polystyrene (PS) composites filled with aluminum nitride (A1N) have been prepared. The most notable feature of the present work is that a special dispersion state of the filler in the composite has been formed — aluminum...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/5137 |