Composites for microelectronics applications
In order to improve the thermal properties of polymer at lower filler content, polystyrene (PS) composites filled with aluminum nitride (A1N) have been prepared. The most notable feature of the present work is that a special dispersion state of the filler in the composite has been formed — aluminum...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/5137 |
| Summary: | In order to improve the thermal properties of polymer at lower filler content, polystyrene (PS) composites filled with aluminum nitride (A1N) have been prepared. The most notable feature of the present work is that a special dispersion state of the filler in the composite has been formed — aluminum nitride filler particles surrounding polystyrene matrix particles. The thermal, dielectric property and dynamic mechanical behavior of polymer composite have been investigated as a function of filler volume content, temperature and particle size of polymer matrix. |
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