Composites for microelectronics applications
In order to improve the thermal properties of polymer at lower filler content, polystyrene (PS) composites filled with aluminum nitride (A1N) have been prepared. The most notable feature of the present work is that a special dispersion state of the filler in the composite has been formed — aluminum...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis |
| Published: |
2008
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/5137 |
| _version_ | 1811694389648424960 |
|---|---|
| author | Yu, Suzhu. |
| author2 | Hing, Peter |
| author_facet | Hing, Peter Yu, Suzhu. |
| author_sort | Yu, Suzhu. |
| collection | NTU |
| description | In order to improve the thermal properties of polymer at lower filler content, polystyrene (PS) composites filled with aluminum nitride (A1N) have been prepared. The most notable feature of the present work is that a special dispersion state of the filler in the composite has been formed — aluminum nitride filler particles surrounding polystyrene matrix particles. The thermal, dielectric property and dynamic mechanical behavior of polymer composite have been investigated as a function of filler volume content, temperature and particle size of polymer matrix. |
| first_indexed | 2024-10-01T07:06:48Z |
| format | Thesis |
| id | ntu-10356/5137 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T07:06:48Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/51372023-03-04T16:32:43Z Composites for microelectronics applications Yu, Suzhu. Hing, Peter School of Materials Science & Engineering DRNTU::Engineering::Materials::Composite materials In order to improve the thermal properties of polymer at lower filler content, polystyrene (PS) composites filled with aluminum nitride (A1N) have been prepared. The most notable feature of the present work is that a special dispersion state of the filler in the composite has been formed — aluminum nitride filler particles surrounding polystyrene matrix particles. The thermal, dielectric property and dynamic mechanical behavior of polymer composite have been investigated as a function of filler volume content, temperature and particle size of polymer matrix. Master of Engineering (MSE) 2008-09-17T10:20:57Z 2008-09-17T10:20:57Z 2000 2000 Thesis http://hdl.handle.net/10356/5137 Nanyang Technological University 166 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Materials::Composite materials Yu, Suzhu. Composites for microelectronics applications |
| title | Composites for microelectronics applications |
| title_full | Composites for microelectronics applications |
| title_fullStr | Composites for microelectronics applications |
| title_full_unstemmed | Composites for microelectronics applications |
| title_short | Composites for microelectronics applications |
| title_sort | composites for microelectronics applications |
| topic | DRNTU::Engineering::Materials::Composite materials |
| url | http://hdl.handle.net/10356/5137 |
| work_keys_str_mv | AT yusuzhu compositesformicroelectronicsapplications |