Permanent polymer bonding for MEMS device fabrication and packaging applications
Permanent wafer bonding with polymers as intermediate adhesive layers plays an important role in fabrication for MEMS systems such as integrated circuits and packaging applications. Polymer adhesive wafer bonding has gained much interest due to its low cost, robust and simple fabrication pr...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2013
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| Online Access: | http://hdl.handle.net/10356/53124 |