Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards
Modern electronic products are becoming lighter in weight and smaller in size as well as its increasing functionality. They are often experiencing the severe vibration and shock environment in many applications. Drop/impact tolerance, or the ability to safely withstand accidental drop/impact, is bec...
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| Format: | Thesis |
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2008
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| Online Access: | https://hdl.handle.net/10356/5368 |