Study of solder joints for ball grid array (BGA) assembly
This thesis aims to study failure characteristics of solder joints (10Sn/90Pb solder ball and eutetic Sn-Pb solder fillet) in Ceramic Ball Grid Array (CBGA) and assembly, and investigate the effect of Accelerated Thermal Cycling (ATC) and reflow atmosphere on joint failure. Metallographic sections a...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/5442 |