Study of solder joints for ball grid array (BGA) assembly
This thesis aims to study failure characteristics of solder joints (10Sn/90Pb solder ball and eutetic Sn-Pb solder fillet) in Ceramic Ball Grid Array (CBGA) and assembly, and investigate the effect of Accelerated Thermal Cycling (ATC) and reflow atmosphere on joint failure. Metallographic sections a...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis |
| Published: |
2008
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/5442 |
| _version_ | 1811691203153887232 |
|---|---|
| author | Yam, Shong Wai |
| author2 | Wong, Brian Stephen |
| author_facet | Wong, Brian Stephen Yam, Shong Wai |
| author_sort | Yam, Shong Wai |
| collection | NTU |
| description | This thesis aims to study failure characteristics of solder joints (10Sn/90Pb solder ball and eutetic Sn-Pb solder fillet) in Ceramic Ball Grid Array (CBGA) and assembly, and investigate the effect of Accelerated Thermal Cycling (ATC) and reflow atmosphere on joint failure. Metallographic sections and fracture surfaces of solder joints were examined using optical and Scanning Electron Microscope (SEM). |
| first_indexed | 2024-10-01T06:16:09Z |
| format | Thesis |
| id | ntu-10356/5442 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T06:16:09Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/54422023-03-11T16:54:36Z Study of solder joints for ball grid array (BGA) assembly Yam, Shong Wai Wong, Brian Stephen School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing This thesis aims to study failure characteristics of solder joints (10Sn/90Pb solder ball and eutetic Sn-Pb solder fillet) in Ceramic Ball Grid Array (CBGA) and assembly, and investigate the effect of Accelerated Thermal Cycling (ATC) and reflow atmosphere on joint failure. Metallographic sections and fracture surfaces of solder joints were examined using optical and Scanning Electron Microscope (SEM). Master of Science (Mechanics & Processing of Materials) 2008-09-17T10:50:42Z 2008-09-17T10:50:42Z 2002 2002 Thesis http://hdl.handle.net/10356/5442 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing Yam, Shong Wai Study of solder joints for ball grid array (BGA) assembly |
| title | Study of solder joints for ball grid array (BGA) assembly |
| title_full | Study of solder joints for ball grid array (BGA) assembly |
| title_fullStr | Study of solder joints for ball grid array (BGA) assembly |
| title_full_unstemmed | Study of solder joints for ball grid array (BGA) assembly |
| title_short | Study of solder joints for ball grid array (BGA) assembly |
| title_sort | study of solder joints for ball grid array bga assembly |
| topic | DRNTU::Engineering::Manufacturing |
| url | http://hdl.handle.net/10356/5442 |
| work_keys_str_mv | AT yamshongwai studyofsolderjointsforballgridarraybgaassembly |