Investigation and optimization of in-process dressing of chemical mechanical polishing
Chemical Mechanical Polishing (CMP) is the technique known to provide global planarization of topography with low post planarization slope and it is a technique to planarize the dielectric layers, which insulate the multilevel interconnect and it can reduces the topography over layer scales the conv...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/5510 |