Fabrication and thermal stress analysis for PZT thin-layered structures
Multi-layered thin film structures with silicon as substrate are widely used in modern electronic industry as building blocks of micro devices and systems. When multiple thin film layers are deposited or grown on a silicon substrate, residual stresses are inevitably arisen inside the thin films d...
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| Médium: | Diplomová práce |
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2008
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| On-line přístup: | http://hdl.handle.net/10356/5546 |