Transient liquid phase bonding using Ni/Sn multilayers for high temperature applications
With growing demand in electronic system for operating in harsh conditions makes the idea of research focus more on a reliable and resilient packaging of the interconnect components. The components of these devices are subjected to wide range of temperatures therefore the reliability and resilience...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2014
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/55856 |