Accelerated electron beam curable resin systems for microelectronics application
Increasing application in the aerospace and microelectronics industries has led to the demand for accelerated curing of high performance structural adhesive systems such as epoxy. Particularly for the microelectronics industry, the curing of thermoset systems has become the bottleneck of the whole p...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/5611 |