Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages

This thesis evaluated the quality of the silicon/die attach/copper leadframe interfaces by using normal incidence ultrasonic waves.

Bibliographic Details
Main Author:	Abdul Jaleel B. Shahul Hamid
Other Authors:	Guo, Ningqun
Format:	Thesis
Published:	2008
Subjects:	DRNTU::Engineering::Manufacturing
Online Access:	http://hdl.handle.net/10356/5673

Internet

http://hdl.handle.net/10356/5673