Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages
This thesis evaluated the quality of the silicon/die attach/copper leadframe interfaces by using normal incidence ultrasonic waves.
| Autor principal: | |
|---|---|
| Otros Autores: | |
| Formato: | Tesis |
| Publicado: |
2008
|
| Materias: | |
| Acceso en línea: | http://hdl.handle.net/10356/5673 |
| Sumario: | This thesis evaluated the quality of the silicon/die attach/copper leadframe interfaces by using normal incidence ultrasonic waves. |
|---|