Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages
This thesis evaluated the quality of the silicon/die attach/copper leadframe interfaces by using normal incidence ultrasonic waves.
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| Other Authors: | |
| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/5673 |
| _version_ | 1826121095069040640 |
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| author | Abdul Jaleel B. Shahul Hamid |
| author2 | Guo, Ningqun |
| author_facet | Guo, Ningqun Abdul Jaleel B. Shahul Hamid |
| author_sort | Abdul Jaleel B. Shahul Hamid |
| collection | NTU |
| description | This thesis evaluated the quality of the silicon/die attach/copper leadframe interfaces by using normal incidence ultrasonic waves. |
| first_indexed | 2024-10-01T05:27:08Z |
| format | Thesis |
| id | ntu-10356/5673 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T05:27:08Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/56732023-03-11T16:54:04Z Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages Abdul Jaleel B. Shahul Hamid Guo, Ningqun School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing This thesis evaluated the quality of the silicon/die attach/copper leadframe interfaces by using normal incidence ultrasonic waves. Master of Engineering (MPE) 2008-09-17T10:56:20Z 2008-09-17T10:56:20Z 2001 2001 Thesis http://hdl.handle.net/10356/5673 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing Abdul Jaleel B. Shahul Hamid Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages |
| title | Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages |
| title_full | Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages |
| title_fullStr | Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages |
| title_full_unstemmed | Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages |
| title_short | Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages |
| title_sort | ultrasonic evaluation of silicon adhesive copper interfaces in ic packages |
| topic | DRNTU::Engineering::Manufacturing |
| url | http://hdl.handle.net/10356/5673 |
| work_keys_str_mv | AT abduljaleelbshahulhamid ultrasonicevaluationofsiliconadhesivecopperinterfacesinicpackages |