Moire measurement of IC packages
Flip-chip components have been studied under thermal-cycles. An ultra sensitive displacement measuring technique Moire interferometry was used to investigate this phenomenon. The Moire interferometer was incorporated with a heating chamber whereby the real-time observation of the thermal-cycle proce...
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| 格式: | Thesis |
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2008
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| 在线阅读: | http://hdl.handle.net/10356/5804 |