Synthesis of borate-based epoxy molding compound for radiation hardened electronics packaging
Recently, considerable attention has been focused on the development of a new class of shielding material made from a mixture of epoxy resin and boron oxide (B2O3). This material exhibits better shielding performance than existing materials thus making it suitable for use in radiation machineries an...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2014
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/59591 |