Advanced wafer bonding for substrate engineering and 3D IC integration
Three dimensional integrated circuits (3D ICs) in the form of several interconnected device layers which are stacked vertically offer a few advantages including improved device performance, form factor and heterogeneous integration. This thesis work is to develop an enabling process technology based...
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| Format: | Thesis |
| Language: | English |
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2014
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| Online Access: | http://hdl.handle.net/10356/60478 |