Thermal bonding and surface modification in the fabrication of COC polymer based microfluidic devices
Cyclic olefin copolymers (COC) are commonly used in the fabrication of microfluidic devices. Several issues need to be addressed before this can be realized. A fundamental understanding of the factors that affect thermal bond strength between different polymer substrates is necessary.This will enabl...
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| Format: | Thesis |
| Language: | English |
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2014
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| Online Access: | http://hdl.handle.net/10356/60586 |