Thermal bonding and surface modification in the fabrication of COC polymer based microfluidic devices
Cyclic olefin copolymers (COC) are commonly used in the fabrication of microfluidic devices. Several issues need to be addressed before this can be realized. A fundamental understanding of the factors that affect thermal bond strength between different polymer substrates is necessary.This will enabl...
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| Format: | Thesis |
| Language: | English |
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2014
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| Online Access: | http://hdl.handle.net/10356/60586 |
| _version_ | 1826122242013003776 |
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| author | Roy, Sunanda |
| author2 | Yue Chee Yoon |
| author_facet | Yue Chee Yoon Roy, Sunanda |
| author_sort | Roy, Sunanda |
| collection | NTU |
| description | Cyclic olefin copolymers (COC) are commonly used in the fabrication of microfluidic devices. Several issues need to be addressed before this can be realized. A fundamental understanding of the factors that affect thermal bond strength between different polymer substrates is necessary.This will enable the selection of suitable substrate pairs so that good thermal sealing between two polymeric substrates in microfluidic devices can be obtained. Furthermore, the intrinsically hydrophobic character of the COC surface has to be rendered hydrophilic to facilitate flow and electrophoretic separation. |
| first_indexed | 2024-10-01T05:45:16Z |
| format | Thesis |
| id | ntu-10356/60586 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T05:45:16Z |
| publishDate | 2014 |
| record_format | dspace |
| spelling | ntu-10356/605862020-11-01T11:32:02Z Thermal bonding and surface modification in the fabrication of COC polymer based microfluidic devices Roy, Sunanda Yue Chee Yoon School of Mechanical and Aerospace Engineering Singapore-MIT Alliance Programme DRNTU::Engineering::Manufacturing Cyclic olefin copolymers (COC) are commonly used in the fabrication of microfluidic devices. Several issues need to be addressed before this can be realized. A fundamental understanding of the factors that affect thermal bond strength between different polymer substrates is necessary.This will enable the selection of suitable substrate pairs so that good thermal sealing between two polymeric substrates in microfluidic devices can be obtained. Furthermore, the intrinsically hydrophobic character of the COC surface has to be rendered hydrophilic to facilitate flow and electrophoretic separation. Doctor of Philosophy (IMST) 2014-05-28T09:08:27Z 2014-05-28T09:08:27Z 2011 2011 Thesis http://hdl.handle.net/10356/60586 en 225 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing Roy, Sunanda Thermal bonding and surface modification in the fabrication of COC polymer based microfluidic devices |
| title | Thermal bonding and surface modification in the fabrication of COC polymer based microfluidic devices |
| title_full | Thermal bonding and surface modification in the fabrication of COC polymer based microfluidic devices |
| title_fullStr | Thermal bonding and surface modification in the fabrication of COC polymer based microfluidic devices |
| title_full_unstemmed | Thermal bonding and surface modification in the fabrication of COC polymer based microfluidic devices |
| title_short | Thermal bonding and surface modification in the fabrication of COC polymer based microfluidic devices |
| title_sort | thermal bonding and surface modification in the fabrication of coc polymer based microfluidic devices |
| topic | DRNTU::Engineering::Manufacturing |
| url | http://hdl.handle.net/10356/60586 |
| work_keys_str_mv | AT roysunanda thermalbondingandsurfacemodificationinthefabricationofcocpolymerbasedmicrofluidicdevices |