Development of polyurethane rubber- modified epoxy resin for microelectronics packaging
This project seeks to modify and characterise an epoxy-moulding compound using polyurethane-based rubber (stress modifier) for microelectronics packaging. The possibilities of incorporating polyurethane stress modifiers in a commercial moulding compound and their effects on its properties are explor...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis |
| Published: |
2008
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/6084 |