Analysis of heat dissipation and thermal enhancements in electronic packages

In this study, thermal characterization is carried out under natural and forced cooling conditions for four kinds of electronic packages.

Bibliographic Details
Main Author:	Loh, Chiah Vern.
Other Authors:	Chan, Yiu Wing
Format:	Thesis
Published:	2008
Subjects:	DRNTU::Engineering::Manufacturing
Online Access:	http://hdl.handle.net/10356/6087

Internet

http://hdl.handle.net/10356/6087