Vibration and thermal cycling effects on solder joint reliability

Vibration and thermal cycling effects on solder joint reliability

This report describes vibration and thermal cycling effects on solder joint reliability, especially its relationship concerning the life prediction of solder joints. It highlights critical parameters needed to support a better understanding of solder joint reliability arising from failure mechanisms...

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Bibliographic Details
Main Author: Selvanathen, Daryl
Other Authors: Pang Hock Lye, John
Format: Final Year Project (FYP)
Language:English
Published: 2014
Subjects:
DRNTU::Engineering::Mechanical engineering
Online Access:http://hdl.handle.net/10356/60912

Internet

http://hdl.handle.net/10356/60912

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