Design-for-reliability methodology for lead-free solder joints

In this project, a Design-For-Reliability (DFR) methodology was developed for solder joints. This methodology consists of three parts, (1) experimental methods for reliability test, (2) Finite Element Analysis (FEA): Modeling and Simulation and (3) Fatigue Life Prediction Analysis. This methodology...

Fuld beskrivelse

Bibliografiske detaljer
Hovedforfatter: Low, Tse Hoong
Andre forfattere: Pang, John Hock Lye
Format: Thesis
Udgivet: 2008
Fag:
Online adgang:https://hdl.handle.net/10356/6112