Design-for-reliability methodology for lead-free solder joints
In this project, a Design-For-Reliability (DFR) methodology was developed for solder joints. This methodology consists of three parts, (1) experimental methods for reliability test, (2) Finite Element Analysis (FEA): Modeling and Simulation and (3) Fatigue Life Prediction Analysis. This methodology...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis |
| Published: |
2008
|
| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/6112 |
| _version_ | 1826117482328358912 |
|---|---|
| author | Low, Tse Hoong |
| author2 | Pang, John Hock Lye |
| author_facet | Pang, John Hock Lye Low, Tse Hoong |
| author_sort | Low, Tse Hoong |
| collection | NTU |
| description | In this project, a Design-For-Reliability (DFR) methodology was developed for solder joints. This methodology consists of three parts, (1) experimental methods for reliability test, (2) Finite Element Analysis (FEA): Modeling and Simulation and (3) Fatigue Life Prediction Analysis. This methodology aims to reduce the time taken to understand and improve the reliability and performance of electronic assemblies with lead-free solder joints. |
| first_indexed | 2024-10-01T04:28:18Z |
| format | Thesis |
| id | ntu-10356/6112 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T04:28:18Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/61122023-03-11T17:36:35Z Design-for-reliability methodology for lead-free solder joints Low, Tse Hoong Pang, John Hock Lye School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics In this project, a Design-For-Reliability (DFR) methodology was developed for solder joints. This methodology consists of three parts, (1) experimental methods for reliability test, (2) Finite Element Analysis (FEA): Modeling and Simulation and (3) Fatigue Life Prediction Analysis. This methodology aims to reduce the time taken to understand and improve the reliability and performance of electronic assemblies with lead-free solder joints. MASTER OF ENGINEERING (MPE) 2008-09-17T11:07:03Z 2008-09-17T11:07:03Z 2005 2005 Thesis Low, T. H. (2005). Design-for-reliability methodology for lead-free solder joints. Master’s thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/6112 10.32657/10356/6112 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics Low, Tse Hoong Design-for-reliability methodology for lead-free solder joints |
| title | Design-for-reliability methodology for lead-free solder joints |
| title_full | Design-for-reliability methodology for lead-free solder joints |
| title_fullStr | Design-for-reliability methodology for lead-free solder joints |
| title_full_unstemmed | Design-for-reliability methodology for lead-free solder joints |
| title_short | Design-for-reliability methodology for lead-free solder joints |
| title_sort | design for reliability methodology for lead free solder joints |
| topic | DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics |
| url | https://hdl.handle.net/10356/6112 |
| work_keys_str_mv | AT lowtsehoong designforreliabilitymethodologyforleadfreesolderjoints |