Bonding technology for semiconductor wafers and structures
Silicon had been a dominant material in the Very Large Scale Integration (VLSI) technology which are commonly used in microprocessors and memory devices. Most III- IV compound semiconductor are direct bandgap materials and are commonly used in optoelectronic application such as in Light Emitting Dio...
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| Format: | Final Year Project (FYP) |
| Jezik: | English |
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2014
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| Online pristup: | http://hdl.handle.net/10356/61326 |