Enhanced microscale heat transfer in macro geometry: effect of groove orientation and working fluid
The present era is the age of computing and this revolution is being powered by microchips that are becoming increasingly powerful by the day. This increase in processing power, however, is accompanied by very high heat dissipation in the range of 100 W/cm2. In fact, insufficient cooling for microch...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2014
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| Online Access: | http://hdl.handle.net/10356/61363 |