Development of carbon nanotubes for interconnects and nano-packaging applications
As the scaling in CMOS technology is nearing its limits, the new scaling trend emphasize on making chips smaller, with higher performance and more functionality. This is putting a huge demand on the backend packaging modules, and the industries are now looking at the various challenges faced at the...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis |
| Language: | English |
| Published: |
2014
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/61597 |