Thermal management of integrated electronics
With technology advancing exponentially, sizes of these electronic devices are decreasing as well. As the sizes decreases, the area for heat dissipation will be smaller. This will in turn lead to a rise in temperature which the integrated circuit (IC) may not be able to withstand. This may cause the...
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| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
2015
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| Online Access: | http://hdl.handle.net/10356/63871 |