Development of a 3D optical testing system for the study of IC packaging
The main objective of this study is to develop an advanced 3-D optical testing system to measure the deformations of IC packages accurately and comprehensively. The present study consists of two parts: 1) development and construction of an advanced compact 3-D optical testing system; and 2) applicat...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis |
| Published: |
2008
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/6408 |