Optimization and application of Epon SU-8, an ultra-thick negative photoresist
Another application that requires ultra-thick photoresist films is micromachining in MEMS. Extremely large structure heights are frequently required for micro-electrodeposition of mechanical components such as coils, cantilevers and valves. These applications may require photoresist in excess of a h...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/6465 |
| _version_ | 1824454205629267968 |
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| author | Tan, Khee Lip. |
| author2 | Yang, Lin Jiang |
| author_facet | Yang, Lin Jiang Tan, Khee Lip. |
| author_sort | Tan, Khee Lip. |
| collection | NTU |
| description | Another application that requires ultra-thick photoresist films is micromachining in MEMS. Extremely large structure heights are frequently required for micro-electrodeposition of mechanical components such as coils, cantilevers and valves. These applications may require photoresist in excess of a hundred microns in thickness. The patterning of high aspect ratio structures in these ultra-thick photoresist films is extremely challenging. The aspect ratios easily exceed those encountered in submicron lithography for standard integrated circuit (IC) manufacturing. Unlike thin photoresist for IC manufacturing, lithography modelling and characterisation are not readily available for ultra-thick photoresist films. |
| first_indexed | 2025-02-19T03:18:37Z |
| format | Thesis |
| id | ntu-10356/6465 |
| institution | Nanyang Technological University |
| last_indexed | 2025-02-19T03:18:37Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/64652023-03-11T17:17:55Z Optimization and application of Epon SU-8, an ultra-thick negative photoresist Tan, Khee Lip. Yang, Lin Jiang School of Mechanical and Production Engineering Gong, Thomas Haiqing DRNTU::Engineering::Manufacturing Another application that requires ultra-thick photoresist films is micromachining in MEMS. Extremely large structure heights are frequently required for micro-electrodeposition of mechanical components such as coils, cantilevers and valves. These applications may require photoresist in excess of a hundred microns in thickness. The patterning of high aspect ratio structures in these ultra-thick photoresist films is extremely challenging. The aspect ratios easily exceed those encountered in submicron lithography for standard integrated circuit (IC) manufacturing. Unlike thin photoresist for IC manufacturing, lithography modelling and characterisation are not readily available for ultra-thick photoresist films. Master of Engineering (MPE) 2008-09-17T11:15:40Z 2008-09-17T11:15:40Z 2000 2000 Thesis http://hdl.handle.net/10356/6465 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing Tan, Khee Lip. Optimization and application of Epon SU-8, an ultra-thick negative photoresist |
| title | Optimization and application of Epon SU-8, an ultra-thick negative photoresist |
| title_full | Optimization and application of Epon SU-8, an ultra-thick negative photoresist |
| title_fullStr | Optimization and application of Epon SU-8, an ultra-thick negative photoresist |
| title_full_unstemmed | Optimization and application of Epon SU-8, an ultra-thick negative photoresist |
| title_short | Optimization and application of Epon SU-8, an ultra-thick negative photoresist |
| title_sort | optimization and application of epon su 8 an ultra thick negative photoresist |
| topic | DRNTU::Engineering::Manufacturing |
| url | http://hdl.handle.net/10356/6465 |
| work_keys_str_mv | AT tankheelip optimizationandapplicationofeponsu8anultrathicknegativephotoresist |