Enhancement of flow boiling using 3D printed porous structures
With the ever-increasing density and compactness of microprocessors on a chip, the heat generated by these electronic units rises along. The rate of heat dissipation has become a limiting factor in the performance of the chips and hence, it is of vital importance that efforts in searching for effect...
Main Author: | |
---|---|
Other Authors: | |
Format: | Final Year Project (FYP) |
Language: | English |
Published: |
2016
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/65859 |