Enhancement of flow boiling using 3D printed porous structures
With the ever-increasing density and compactness of microprocessors on a chip, the heat generated by these electronic units rises along. The rate of heat dissipation has become a limiting factor in the performance of the chips and hence, it is of vital importance that efforts in searching for effect...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2016
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| Online Access: | http://hdl.handle.net/10356/65859 |