Improving adhesion of copper thin films of alumina substrate through interface engineering
Topic of adhesion has been well known in the scientific community due to its wide range of applications in microelectronics. Research on adhesion has been extensively carried out for improvement on the interfacial joining between materials. In microelectronic packaging, ceramic metallization has bee...
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| Format: | Thesis |
| Language: | English |
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2016
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| Online Access: | https://hdl.handle.net/10356/65944 |