Investigation of nano-copper for electronic packaging application : solder metallization and die attach
Nano-copper (NC) has been developed recently with good potential for electronic packaging applications. In this work, the interfacial reaction between NC and Sn-3.5Ag and the adhesion between NC and different metallizations were investigated. Thermal Gravimetric Analysis (TGA) results of NC paste we...
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| Format: | Thesis |
| Language: | English |
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2016
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| Online Access: | https://hdl.handle.net/10356/66939 |